Home / Design Support / Packing & Package Information  

 
Packing & Package Information


Please check the most updated package information for Standard Packing Specification, IC Top Marking Information, and Package Outline & Footprint for our solutions. To download the documents requires member’s log-in, if you are already our member, please log-in from the homepage. Should you have further questions please feel free to contact us.



File Download: Package Footprints-A.pdf (2558KB)

File Download: Package Footprints-B.pdf (1407KB)

gotop  

© 力智電子股份有限公司 版權所有
產品 應用 設計支援 業務資訊 關於力智
  總公司 (R&D, Production Center) 地址 : 302 新竹縣竹北市台元一街5號9樓 | TEL : +886-3-560-1666 | FAX : +886-3-560-1888