As a result of Ultra_Low Rss(on) demand for recent Quick-Charge application to reduce severe thermal-effect, CSP (Chip Scale Package) type MOSFET will be the ONLY solution against traditional wire-bonding packages.
SakuraFET™, designed by JPD Labo. In Takasaki, Japan, an oversea subsidiary of uPI Group, who leverages the finest back-up process from Japan, to make it the most outstanding product with world’s leading performance and reliability, which is suitable for load switches of protection circuit in lithium battery cells; the full coverage of CSP types, from 4P_4 Pin, 6P_6 Pin, 6PE_6 Pin elliptic, to 10PE_10 Pin elliptic can definitely cover wide-range battery applications of portable devices, including Mobile Phone, Tablets, Power-bank, Wearable, and Notebook.
| UBIQ P/N | PKG | BVD | VGS | Rss(on) | Rss(on) | Product Statu |
| VGS=4.5V | VGS=3.8V | |||||
| QS1B04R4E | CSP 4P | 12 | ±8 | 22 | 24 | M/P Already |
| QS1B01R6E | CSP 6P | 12 | ±8 | 4.8 | 5.1 | M/P Already |
| QS1B03R6E | CSP 6P_ E | 12 | ±8 | 2.1 | 2.2 | M/P Already |
| QS1B05RAE | CSP 10P_E | 12 | ±8 | 1.5 | 1.6 | E/S Available |
| QS1B02RAE | CSP 10P_E | 12 | ±8 | 2.1 | 2.2 | M/P Already |
Features:
- Compact/ Thin packages.
- 2.5V drive.
- Ultra-Low On Resistance.
- ESD protection diode embedded.
- Common drain type.
- 100% Pb-free packages.