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Resonant Gate Drive Enhances Robustness Of GaN Power Stages
Resonance driving of silicon-based power devices has been extensively researched. The use of resonance to save power has been a main focus of this research. In this article, we will show an additional use of resonance—to enhance robustness of circuit operation in GaN...
YAGEO plans to fully participate in uPI’s private placement of common shares and team up for a leading position in power component industry.
YAGEO Corporation (“YAGEO”; 2327.TW) and uPI Semiconductor Corporation (“uPI”;6719.TW) have reached the decision through their respective Boards of Directors today that YAGEO will participate fully in uPI’s private placement for 21 million shares, and Mr. Pierre Chen...
Visit uPI Semiconductor Corp. at APEC Booth 1716
Join uPI Semi at the upcoming Applied Power Electronics Conference & Exposition (APEC) event in Houston, TX to learn more about uPI’s current and next generation power management products.Talk to our experienced engineers to help you select the best high power,...
EPC and uPI Semiconductor to offer GaN solutions with uP1966
EPC and uPI Semiconductor are partnering to offer the uP1966 GaN half-bridge driver to the markets. The uP1966E is an 85 V dual-channel gate driver designed to drive both high-side and low-side eGaN® FETS in half-bridge and full-bridge topologies. The driver...
uPI Semiconductor Corp. (6719) has been registered for trading on the Emerging Stock Board from March 12, 2021.
uPI Semiconductor, known for its high-efficiency and high-density power solutions, is deeply involved in high-performance computing, consumer electronics, communication, battery protection, and industrial fields, with a product portfolio including power management...
ASRock Launches New Motherboards Featuring uPI Power Management Solutions
Leading global motherboard manufacturer, ASRock, has announced its latest flagship motherboard, the Z490 AQUA to the delight of gamers and power hungry users alike. Feature Packed Using the latest 16 Phase 90A Dr.MOS & 2oz Copper PCBs, it delivers up to 95% VRM...
Visit uPI Semiconductor Corp. at APEC Booth 1255
Join uPI Semi at the upcoming Applied Power Electronics Conference & Exposition (APEC) event in New Orleans, LA to learn more about uPI’s current and next generation power management products. Talk to our experienced electronics engineers to help you select the...
Visit uPI Semiconductor Corp. at APEC booth #153
uPI Semiconductor Corp. will be at the Applied Power Electronics Conference & Exposition (APEC), in Anaheim, California, March 17-21, 2019. Stop by booth #153 to watch our live demonstrations and learn about uPI’s current and next generation power management...
Power Solutions for Today’s Gamers and Tomorrow’s
One day ahead of Gamescom 2018 - the world’s largest gaming event – NVIDIA® hosted an kicked off GeForce® gaming event with a keynote speech by NVIDIA® ’s founder and CEO, Mr. Jensen Huang to announce the first gaming GPUs powered by the NVIDIA RTX™ platform and new...
uPI Powers the Just-Announced NVIDIA® Quadro® RTX™
At the professional graphics-focused SIGGRAPH conference held in Vancouver, Jensen Huang, NVIDIA®’s founder and CEO announced the first Turing™ architecture-based GPUs, following to that he unveiled the NVIDIA® Quadro® RTX 8000, Quadro RTX 6000 and Quadro RTX 5000,...
uPI Introduces QZ-series TVS with Deep Snap Back Feature
According to Moore’s Law, the transistors in SOCs double about every two years through shrinking CMOS processes. This shrink drives junction depth and smaller Gate Oxide Thicknesses which results in higher sensitivity to ESD events. Some devices can only support ESD...
Ultra High Speed 80V HB Driver for GaN Application
New Levels of Power Density Silicon MOSFETs has used extensively in most power application since 35 years ago that displaced the bipolar transistor. In these 10 years, Gallium Nitride (GaN) is already an established semiconductor material, employed extensively in LED...
SakuraFET™ – Thinner, Lighter, Cooler for Battery Applications
As a result of Ultra_Low Rss(on) demand for recent Quick-Charge application to reduce severe thermal-effect, CSP (Chip Scale Package) type MOSFET will be the ONLY solution against traditional wire-bonding packages. SakuraFET™, designed by JPD Labo. In Takasaki, Japan,...
UBIQ TVS – Broad Portfolio for Personal Computing
From audio to video, from normal speed data rate to high speed date rate, I/O ports are everywhere to connect devices for personal computing. Not only provide robustness for ESD strikes, but also provide Low Clamping and Low Capacitance to protect system chips, UBIQ...
Ultra Low Cap. TVS – Ideal Solution for High Speed Interface
Along with technology innovation , the transmission rate for massive data between devices rapidly increases. High speed interfaces with data rates in Gbit/ sec range ONLY allow minimum additional capacitance on the line. Due to miniaturization, the smaller the size,...
Declaration of Authorized Distributors
Recently, uPI Semiconductor Corporation learned that Shenzhen An Ge Ruei Technology Corporation and other distributors falsely declared they were authorized distributors of uPI Semiconductor Corporation's products and intentionally sold erroneous products at...
Dual-N
Along with Ultra-Low-FOM process innovation, UBIQ Semiconductor Corp. announces a whole new series of highly integrated H/S side Dual-N MOSFET for buck converter applications, a high power density solution which could provide Iout up to 25A per phase. The patented...
High Reliability Secondary Protection Solution of Lithium Ion Battery for Multi-Cells Application
According to popularization of mobile technology and Smartphone, high capacity low weight of lithium ion battery (LiB) is quite normally used in our daily life. However safety issue of lithium ion battery is concerned as potential damage to people’s properties even...
Full segment VCORE Solution Launched for AMD CPU/GPU
When tick-tock is no longer the rule, the market of personal computing becomes even more dynamic along with the optimized process, and revolutionary applications. Wherever however the giants move, the best strategy is to be always prepared. uPI has prepared a set of...
High Power Density Integrated Fast-charging Solutions
Semiconductor, a precision power solution provider, introduces its latest high density, highly integrated fast-charging solutions designed for power bank, power strip, and car charger applications. With multiple integrated charging protocols (uP9616/uP7104) and...
Specialty Driver for Gallium Nitride (GaN) power FETs
Higher density, greater efficiency became a real introduction instead of sales pitch when Gallium Nitride (GaN) power FETs came into the world of power conversion, where silicon MOSFETs has reached the limitation in massive application. What follows the benefit of...
The Pursuit of Power – Total Solution for Upcoming Graphics Platform
On one end of the computing world the GPUs and CPUs never stop intensifying the performance, while on the other efficiency and balanced cost is the key. uPI is endeavored to develop power solutions that satisfied both ends. A recent launch of a series of PWM...
uPI Semiconductor Corp will attend the IIC-China 2015 Fall Exhibition.
IIC-China is the country's annual systems design event where engineers, technology vendors and new ideas meet. On its 20th anniversary, uPI Semiconductor Corp will be participating in this exhibition and face-to-face with China's design innovators as they look for new...
uPI Semiconductor Corp will attend the IIC-China 2014 Fall Exhibition.
IC-China is the country's annual systems design event where engineers, technology vendors and new ideas meet. On its 19th year, uPI Semiconductor Corp will be participating in this exhibition and face-to-face with China's design innovators as they look for new...