According to Moore’s Law, the transistors in SOCs double about every two years through shrinking CMOS processes. This shrink drives junction depth and smaller Gate Oxide Thicknesses which results in higher sensitivity to ESD events.
Some devices can only support ESD levels lower than 500V HBM. The need to have high performance TVS device in the PCB system design is becoming critical in today’s electronics systems The traditional 5V TVS component is not able to satisfy today’s requirements and while the market has moved to 3.3V TVS devices some Ultra High Speed interfaces, such as USB3.1, Thunderbolt, HDMI2.0., etc, require a lower ESD sustained level.
uPI offers worldwide leading technology with Deep Snap Back and Low Ron functions to support Ultra Low Clamping Voltage TVS for this kind of critical situation. uPI QZ series TVS QZ403UDB50NH and QZ413BD20NH support Deep Snap Back function as well as the low capacitance feature for improved signal integrity in Ultra High Speed Interfaces.