As a result of Ultra_Low Rss(on) demand for recent Quick-Charge application to reduce severe thermal-effect, CSP (Chip Scale Package) type MOSFET will be the ONLY solution against traditional wire-bonding packages. SakuraFET™, designed by JPD Labo. In Takasaki, Japan,...
From audio to video, from normal speed data rate to high speed date rate, I/O ports are everywhere to connect devices for personal computing. Not only provide robustness for ESD strikes, but also provide Low Clamping and Low Capacitance to protect system chips, UBIQ...
Along with technology innovation , the transmission rate for massive data between devices rapidly increases. High speed interfaces with data rates in Gbit/ sec range ONLY allow minimum additional capacitance on the line. Due to miniaturization, the smaller the size,...
Recently, uPI Semiconductor Corporation learned that Shenzhen An Ge Ruei Technology Corporation and other distributors falsely declared they were authorized distributors of uPI Semiconductor Corporation’s products and intentionally sold erroneous products at...
Along with Ultra-Low-FOM process innovation, UBIQ Semiconductor Corp. announces a whole new series of highly integrated H/S side Dual-N MOSFET for buck converter applications, a high power density solution which could provide Iout up to 25A per phase. The patented...
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